EDN

DESIGN TOOLS: IC design flow integrated

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...
Business Wire

SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System

SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...
EDN

TSMC Unveils IC Design Flow For 0.25-, 0.18-Micron Processes

Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Semiconductor Engineering

Secure Physical Design Roadmap Enabling End-To-End Trustworthy IC Design Flow

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...
Digi Times

Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification

Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies. This flow ...
Business Wire

UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies

SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq ...
Nasdaq

Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution

Comprehensive AI-driven data analytics solution aggregates and utilizes data across IC design, test, and manufacturing flow to drive more intelligent decision making. Speeds design closure and ...
Electronic Design

Reducing IC design effort with easy-to-use reliable digital IC design flow

IROC Technologies faced developing an integrated circuit (IC) - from scratch - with limited internal IC design resources. To meet the aggressive tapeout schedule, IROC needed to feel confident in the ...
Semiconductor Engineering

Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...
Forbes

Synopsys Opens The Next Chapter Of AI Tools For Chip Design And Manufacturing

The EDA leader has generated over $500M to date in AI tools and technologies. Now a new data analytics solution applies data management, curation, and analysis across the entire pipeline of chip ...
Digi Times

UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow

United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies. Save my User ID and ...