The assembly of electronic products with SMT has the advantages of small size, good performance, full functionality and low cost. Widely used in aviation, communications, medical electronics, ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
This application note provides the PCB design and SMT assembly guidelines for Maxim Integrated’s leaded packages (SOIC, TSSOP, QSOP, QFP, SC70, SOP, SOT, etc.). Leaded packages are surface-mount ...
TOKYO--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation today announced the launch of “TB67B000FG,” a new three-phase brushless fan motor driver for air conditioners, air purifiers ...
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