Tessera Inc. said Monday (April 14) it will introduce chip-scale packaging technology the company claims provides performance, size, and cost advantages for designers of RF modules used in wireless ...
For packaging semiconductor devices, an important breakthrough was recently announced by RED Micro Wire (www.redmicrowire.com), a subsidiary of RED Equipment, in the area of semiconductor bonding wire ...
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module ...
With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for ...
New York, Feb. 20, 2023 (GLOBE NEWSWIRE) -- According to Persistence Market Research, the global Radio Frequency (RF) Packaging Market is poised to be valued at US$ 29.5 billion in 2023. Total radio ...
EINDHOVEN, The Netherlands, June 06, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled RF amplifier modules, based on a packaging innovation ...
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
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