Semiconductor Engineering

Comparison Of State-Of-The-Art Models For Socket Pin Defect Detection

This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
EDN

Spring Pin Sockets

The Spring Pin Socket line allows very high endurance and wide temperature range testing of BGA and QFN IC's on the same footprint as our other technology sockets for the same IC. This allows ...
Semiconductor Engineering

Enhancing Test Socket Performance Through Application-Specific Validation And System-Level Per-Pin OQC

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
EDN

BGA test socket features precise ball-to-pin alignment

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...